Rpo-6 is the best alternative to develop CMP processes, polish wafers economically on the lab scale. Its highly flexible to polish any kind of material.
- Insitu friction and pad wear measurement
- Interchangeable heads upto 6 inch wafers
- Standard processes and consumable delivery
- Main Features
Chemical Mechanical Polishing (CMP) is a process that is used for the planarization of wafers, materials etc. Polishing takes advantages of the synergetic effect of both physical and chemical forces for polishing of wafers. This is done by applying a load force to the back of a sample while it rests on a pad. Both the pad and sample are then counter rotated while a slurry containing both abrasives and reactive chemicals is passed underneath.
Tester allows to measure friction and wear insitu that helps to study fundamental of polishing. Change is friction allows to charaterise removal rates approximately.
Insitu Pad Wear
Insitu wear rate allows to measure life of pad during polishing, conditioning etc.
Both insitu and ex situ conditioning
Easy to interchange various wafer holders that allows to polish samples from 1inch to 4 inch on same tester
Independent Programmable pumps to supply slurry, water and other chemistries
Consumables and Consultation
We not only supply the instrument but also supply consumables (slurry, pads etc.) for standard polishing materials and provide consultation through our highly qualified team of scientists on process development and optimization.
Manual Wafer Loading
Bench top CMP R&D System.
- Insitu and exsitu conditioning
- Upto 6 inch sample
- Slurry and water lines using programmable pumps
- Insitu friction and pad wear options
- High rigidity and good down force control
- Foot print w870x d800x h870mm
- 170mm platen diameter
- Slurry development
- Particle development
- Process development
- Pad characterization